Viking SuperSPARC AMCM development program

Author

Eichelberger, Charles W. ; Davidson, Howard

Author_Institution

ISA, Woburn, MA, USA

fYear

1993

fDate

15-18 Mar 1993

Firstpage

29

Lastpage

32

Abstract

A program to develop a Viking SuperSparc AMCM is discussed. The program is structured not only to provide a prototype module, but also to resolve key infrastructure issues associated with volume production of the module. The AMCM technology was chosen to fabricate the module. This technology is a chips first approach and offers important advantages in thermal management, power delivery, size and system interface. The program is divided into four phases. The first phase completes the Viking AMCM design and layout. The second phase fabricates and tests first articles. The third place demonstrates bare chip test and burn-in. The final phase produces preproduction qualification samples

Keywords

hybrid integrated circuits; integrated circuit testing; multichip modules; MCM technology; Viking SuperSparc AMCM; bare chip test; burn-in test; power delivery; system interface; thermal management; Capacitors; Connectors; Diodes; Electronics packaging; Instruction sets; Integrated circuit testing; Manufacturing; Production; Sun; Systolic arrays;

fLanguage

English

Publisher

ieee

Conference_Titel

Multi-Chip Module Conference, 1993. MCMC-93, Proceedings., 1993 IEEE

Conference_Location

Santa Cruz, CA

Print_ISBN

0-8186-3540-1

Type

conf

DOI

10.1109/MCMC.1993.302157

Filename

302157