Title :
SuperSPARC multichip module
Author :
Mehta, Aswin ; Kennedy, Jim ; Johnson, Karl ; Cano, Frank ; Anderson, Dan ; Chong, David ; Hamilton, Gerald ; Brady, Don ; Murtuza, Masood ; Hundt, Paul ; Hong, N. ; Valente, Fred ; Rusu, Stefan ; Kaul, Sunil ; Gannon, Terry
Author_Institution :
Texas Instruments Inc., Stafford, TX, USA
Abstract :
An experimental silicon-on-silicon MCM consisting of a SPARC processor, a cache controller and cache memory constructed to study the feasibility of thin film technology for high speed applications is discussed. Results of experiments show that such a design is viable. The trade-offs involved in the selection of a MCM for electrical, thermal and yield performance goals are discussed. Thin film technology provides a viable means of achieving these goals. The lossy nature of the thin film is used to provide series termination and allows high speed pulse propagation to be achieved. Also, the denser design rules permitted by the technology enable a smaller module size
Keywords :
SPICE; VLSI; finite element analysis; integrated circuit technology; multichip modules; MCM; SPARC processor; SPICE simulation; Si-Si; SuperSPARC multichip module; VLSI technology; cache controller; cache memory; design rules; electrical performance; finite element modelling; high speed applications; high speed pulse propagation; module size; semiconductor; series termination; thermal performance; thin film technology; yield performance; Capacitance; Clocks; Couplings; Crosstalk; Dielectric substrates; Dielectric thin films; Electric resistance; Integrated circuit interconnections; Multichip modules; Propagation delay;
Conference_Titel :
Multi-Chip Module Conference, 1993. MCMC-93, Proceedings., 1993 IEEE
Conference_Location :
Santa Cruz, CA
Print_ISBN :
0-8186-3540-1
DOI :
10.1109/MCMC.1993.302158
