Title :
Modelling complex via hole structures
Author :
Laermans, Eric ; De Geest, Jan ; De Zutter, Daniel ; Olyslager, Femke ; Sercu, Stefaan ; Morlion, D.
Author_Institution :
Dept. of Inf. Technol., Ghent Univ., Gent, Belgium
Abstract :
We derive a physics based circuit model for complex via hole structures on PCBs. Capacitances are computed using a three-dimensional electrostatic solver and inductances using a two-dimensional quasi-TEM solver (Olyslager et al, IEEE Trans. Microwave Theory Tech., vol. 39, no. 6, pp. 901-909, 1991)
Keywords :
capacitance; circuit analysis computing; circuit complexity; electrostatics; inductance; packaging; printed circuits; 2D quasi-TEM solver; 3D electrostatic solver; PCB via hole structures; capacitances; complex via hole structures; inductances; modelling; physics based circuit model; Capacitance; Circuit simulation; Couplings; Electrostatic measurements; Finite difference methods; Frequency; Inductance; Magnetic field measurement; Time domain analysis; Transmission line matrix methods;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2001
Conference_Location :
Cambridge, MA
Print_ISBN :
0-7803-7024-4
DOI :
10.1109/EPEP.2001.967633
