DocumentCode :
1938025
Title :
Simultaneous switching noise analysis on bus lines using coupled circuit and electromagnetic simulation
Author :
Mabuchi, Yuichi ; Suwa, Motoo ; Fukumoto, Hideshi ; Nakamura, Atsushi
Author_Institution :
Res. Lab., Hitachi Ltd., Ibaraki, Japan
fYear :
2001
fDate :
2001
Firstpage :
203
Lastpage :
206
Abstract :
Simultaneous switching noise (SSN) on bus lines is calculated by accurately modeling printed circuit boards and LSI packages using coupled circuit and electromagnetic simulation. Contribution of crosstalk and ground bounce to SSN is qualitatively estimated. With relatively low inductance package such as BGA, the main cause of SSN is cross talk which results in increasing SSN voltage along the length of bus line. The results of simulation are compared with those of experiment, the both results agree within 10% difference at maximum peak of SSN
Keywords :
ball grid arrays; circuit simulation; crosstalk; inductance; integrated circuit noise; integrated circuit packaging; large scale integration; printed circuits; system buses; BGA; LSI package; bus line; circuit simulation; crosstalk; electromagnetic simulation; ground bounce; inductance; printed circuit board; simultaneous switching noise; Circuit noise; Circuit simulation; Coupling circuits; Crosstalk; Electromagnetic coupling; Electromagnetic interference; Electromagnetic modeling; Packaging; Printed circuits; Switching circuits;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 2001
Conference_Location :
Cambridge, MA
Print_ISBN :
0-7803-7024-4
Type :
conf
DOI :
10.1109/EPEP.2001.967646
Filename :
967646
Link To Document :
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