Title :
Flat package inductance extraction with ground plane current precalculation
Author :
Lippens, Guntlier ; De Zutter, Daniël
Author_Institution :
Dept. of Inf. Technol. (INTEC), Ghent Univ., Gent, Belgium
Abstract :
A method is presented in which a geometry and frequency dependent precalculation of large pin count flat package ground plane currents is made. We use this precalculation to construct an adaptive non-orthogonal PEEC grid for correct modeling of inductance behaviour of RF packages with minimal ground plane discretisations needed
Keywords :
equivalent circuits; inductance; packaging; RF package; adaptive nonorthogonal PEEC grid; discretisation; flat package; ground plane current; inductance; numerical model; parameter extraction; Capacitance; Conductors; Data mining; Frequency dependence; Inductance; Information geometry; Information technology; Packaging; Radio frequency; Skin;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2001
Conference_Location :
Cambridge, MA
Print_ISBN :
0-7803-7024-4
DOI :
10.1109/EPEP.2001.967650
