Title :
Physically consistent transmission line models for high-speed interconnects in lossy dielectrics
Author :
Coperich, Karen M. ; Morsey, J. ; Cangellaris, Andreas C. ; Ruehli, A.
Author_Institution :
Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
Abstract :
The development of a physically consistent multi-conductor transmission line model for high-speed interconnects in lossy, dispersive dielectrics is presented. Based on this model, a methodology is proposed for the construction of SPICE-compatible equivalent circuits that take into account dielectric loss and dispersion
Keywords :
SPICE; dielectric losses; equivalent circuits; high-speed integrated circuits; integrated circuit interconnections; integrated circuit modelling; multiconductor transmission lines; permittivity; transmission line theory; SPICE equivalent circuit; dielectric dispersion; dielectric loss; high-speed interconnect; multiconductor transmission line model; Bandwidth; Dielectric losses; Dielectric materials; Dielectrics and electrical insulation; Frequency; Integrated circuit interconnections; Permittivity; Propagation losses; Transmission lines; Wiring;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2001
Conference_Location :
Cambridge, MA
Print_ISBN :
0-7803-7024-4
DOI :
10.1109/EPEP.2001.967656
