Title :
Design and performance evaluation of PentiumR III microprocessor packaging
Author :
Sarangi, Ananda ; Ji, Gang ; Arabi, Tawfik ; Taylor, Gregory F.
Author_Institution :
Intel Corp., Hillsboro, OR, USA
Abstract :
This paper describes a design methodology to determine the number of chip capacitors needed and its placement scheme for the latest PentiumR III microprocessor package substrate for optimum performance. The effect of capacitors on the power supply and its performance and placement schemes are discussed and compared against measurements. Performance improvements are outlined and compared between the current 0.13 μm and the previous 0.18 μm silicon package technology designed for compatibility with existing systems
Keywords :
capacitors; integrated circuit design; integrated circuit interconnections; integrated circuit measurement; integrated circuit modelling; integrated circuit packaging; microprocessor chips; power supply circuits; 0.13 micron; 0.18 micron; Pentium III microprocessor package substrate; Pentium III microprocessor packaging; Si; capacitor effects; chip capacitors; design evaluation; design methodology; measurements; optimum performance; performance evaluation; placement scheme; power supply; silicon package technology; Capacitors; Frequency; Inductance; Microprocessors; Packaging; Power measurement; Power supplies; Power system modeling; Semiconductor device measurement; Variable structure systems;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2001
Conference_Location :
Cambridge, MA
Print_ISBN :
0-7803-7024-4
DOI :
10.1109/EPEP.2001.967666
