DocumentCode
1938727
Title
Solution space analysis of interconnects for low voltage differential signaling (LVDS) applications
Author
Ahn, Seungyoung ; Lu, Albert Chee W ; Fan, Wei ; Lai, L.W. ; Kim, Joungho
Author_Institution
Electron. Packaging Group, Gintic Inst. of Manuf. Technol., Singapore, Singapore
fYear
2001
fDate
2001
Firstpage
327
Lastpage
330
Abstract
This paper presents a solution space analysis of differential interconnects for low voltage differential signal (LVDS) applications. The interconnect performance has been evaluated using frequency-domain 3-D full-wave simulation, TDR measurement and time-domain transient simulation
Keywords
frequency-domain analysis; integrated circuit interconnections; time-domain analysis; time-domain reflectometry; TDR measurement; differential interconnect; frequency-domain 3-D full-wave simulation; low voltage differential signaling; solution space analysis; time-domain transient simulation; Conducting materials; Conductors; Dielectrics; Impedance; Low voltage; Propagation constant; Scattering parameters; Signal analysis; Space technology; Submillimeter wave technology;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2001
Conference_Location
Cambridge, MA
Print_ISBN
0-7803-7024-4
Type
conf
DOI
10.1109/EPEP.2001.967674
Filename
967674
Link To Document