DocumentCode
1938961
Title
Demonstration of 30-Tbps/cm2 bandwidth density by silicon optical interposers fully integrated with optical components
Author
Urino, Yutaka ; Akiyama, Soramichi ; Akagawa, Takeshi ; Baba, Toshihiko ; Usuki, Tatsuya ; Okamoto, Dai ; Miura, Masaki ; Fujikata, J. ; Shimizu, Tsuyoshi ; Okano, Makoto ; Hatori, Nobuaki ; Ishizaka, Masashige ; Yamamoto, Takayuki ; Takahashi, Hiroki ; N
fYear
2013
fDate
22-26 Sept. 2013
Firstpage
1
Lastpage
3
Abstract
Silicon optical interposers for inter-chip interconnects, integrated with lasers, optical splitters, modulators, waveguides and photodetectors on a single silicon substrate were demonstrated. They were optically complete and closed systems. We achieved 20-Gbps error-free data transmission and a 30-Tbps/cm2 bandwidth density using these interposers.
Keywords
integrated optoelectronics; optical beam splitters; optical communication equipment; optical interconnections; optical modulation; photodetectors; waveguide lasers; Si; bandwidth density; bit rate 20 Gbit/s; error-free data transmission; integrated lasers; integrated optical components; interchip interconnects; optical modulators; optical splitters; optical waveguides; optically closed system; optically complete system; photodetectors; silicon optical interposers; single silicon substrate;
fLanguage
English
Publisher
iet
Conference_Titel
Optical Communication (ECOC 2013), 39th European Conference and Exhibition on
Conference_Location
London
Electronic_ISBN
978-1-84919-759-5
Type
conf
DOI
10.1049/cp.2013.1305
Filename
6647498
Link To Document