DocumentCode
1939002
Title
Transparent encapsulating resin for automotive applications
Author
Ito, Hisataka ; Noro, Hiroshi ; Oota, Shinya
Author_Institution
NITTO DENKO Corp., Kameyama, Japan
fYear
2010
fDate
24-26 Aug. 2010
Firstpage
1
Lastpage
4
Abstract
In this paper, a transparent encapsulating technology for automotive optical semiconductor devices is presented in terms of keeping higher reliability requirement for this market. This is transparent epoxy based encapsulation material that is using thermo set curing system. In compared with standard consumer application, automotive applications include those requiring materials with a high degree of purity, strong surface adhesion, or transparent fillers that are required to handle extremes of heat and humidity condition. LEDs have been used for many years in the displays of car audio systems and instrument panels. In addition to using LEDs for stoplights, future applications include various automotive optical sensors.
Keywords
automotive electronics; encapsulation; light emitting diodes; resins; LED; automotive application; automotive optical semiconductor device; automotive optical sensor; car audio system; heat condition; higher reliability requirement; humidity condition; instrument panel; standard consumer application; stoplights; strong surface adhesion; thermo set curing system; transparent encapsulating resin; transparent encapsulating technology; transparent epoxy based encapsulation material; transparent filler; Encapsulation; Integrated optics; Optical sensors; Reliability; Resins;
fLanguage
English
Publisher
ieee
Conference_Titel
CPMT Symposium Japan, 2010 IEEE
Conference_Location
Tokyo
Print_ISBN
978-1-4244-7593-3
Type
conf
DOI
10.1109/CPMTSYMPJ.2010.5680292
Filename
5680292
Link To Document