• DocumentCode
    1939002
  • Title

    Transparent encapsulating resin for automotive applications

  • Author

    Ito, Hisataka ; Noro, Hiroshi ; Oota, Shinya

  • Author_Institution
    NITTO DENKO Corp., Kameyama, Japan
  • fYear
    2010
  • fDate
    24-26 Aug. 2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    In this paper, a transparent encapsulating technology for automotive optical semiconductor devices is presented in terms of keeping higher reliability requirement for this market. This is transparent epoxy based encapsulation material that is using thermo set curing system. In compared with standard consumer application, automotive applications include those requiring materials with a high degree of purity, strong surface adhesion, or transparent fillers that are required to handle extremes of heat and humidity condition. LEDs have been used for many years in the displays of car audio systems and instrument panels. In addition to using LEDs for stoplights, future applications include various automotive optical sensors.
  • Keywords
    automotive electronics; encapsulation; light emitting diodes; resins; LED; automotive application; automotive optical semiconductor device; automotive optical sensor; car audio system; heat condition; higher reliability requirement; humidity condition; instrument panel; standard consumer application; stoplights; strong surface adhesion; thermo set curing system; transparent encapsulating resin; transparent encapsulating technology; transparent epoxy based encapsulation material; transparent filler; Encapsulation; Integrated optics; Optical sensors; Reliability; Resins;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    CPMT Symposium Japan, 2010 IEEE
  • Conference_Location
    Tokyo
  • Print_ISBN
    978-1-4244-7593-3
  • Type

    conf

  • DOI
    10.1109/CPMTSYMPJ.2010.5680292
  • Filename
    5680292