High reliability epoxy encapsulating compound for power module

Author

Kitagawa, Yuya ; Yano, Satomi ; Hironori, Kobayashi ; Mizushima, Aya

Author_Institution

NITTO DENKO Corp., Kameyama, Japan

fYear

2010

fDate

24-26 Aug. 2010

Firstpage

1

Lastpage

4

Abstract

In this paper, high reliability epoxy encapsulating compound (EMC) suitable for a power device working at a high temperature is reported. Driven by Miniaturization of module, cost reduction by the simplification of cooling system, Tj temperature of the power module is a tendency to rise. Corresponding to this tendency, EMC is needed high heat resistant performance such as heat cycle test (TCT) and power cycle test. Conventional EMC cannot be satisfied with connection reliability over 150 degree. The difference of coefficient of thermal expansion (CTE) between EMC and other packaging materials occurs stress and delamination. To solve this problem, focusing on the relationship between TCT performance and change of mechanical properties of EMC. We suggest one approach to improve TCT performance by Considering the change of mechanical properties of EMC.

Keywords

cooling; delamination; electronics packaging; mechanical strength; modules; power electronics; reliability; resins; adhesive strength; coefficient of thermal expansion; cooling system; cost reduction; delamination; high reliability epoxy encapsulating compound; mechanical properties; packaging materials; power device; power module; stress; Adhesive strength; Delamination; Electromagnetic compatibility; Heating; Indexes; Stress;

fLanguage

English

Publisher

ieee

Conference_Titel

CPMT Symposium Japan, 2010 IEEE

Conference_Location

Tokyo

Print_ISBN

978-1-4244-7593-3

Type

conf

DOI

10.1109/CPMTSYMPJ.2010.5680293

Filename

5680293