Analysis of microstrip structures of finite ground plane using the hybrid volume-surface integral equation approach

Author

Lu, Cai-Cheng ; Yu, Chun

Author_Institution

Dept. of Electr. Eng., Kentucky Univ., Lexington, KY, USA

Volume

4

fYear

2002

fDate

2002

Firstpage

162

Abstract

The hybrid volume-surface integral equation (VSIE) approach has been applied to calculate the input impedance of the printed structure with finite ground plane. The calculated results for a rectangular patch antenna have been compared with experiment and good agreement is observed. When the ground plane size increases, the input impedance converges to the result of infinite ground plane. An important advantage of the VSIE algorithm is that it can be used to simulate the printed structure of finite, arbitrary shaped ground plane.

Keywords

antenna earths; electric impedance; electromagnetic wave scattering; integral equations; microstrip antennas; VSIE algorithm; computational complexity reduction; electrically large-size structures; electromagnetic scattering; finite ground plane; free-space Green´s function; ground plane size; hybrid volume-surface integral equation; infinite ground plane; input impedance; microstrip structures; multilevel fast multipole algorithm; printed structure; rectangular patch antenna; Conductors; Dielectric substrates; Differential equations; Electromagnetic scattering; Green´s function methods; Integral equations; Microstrip; Moment methods; Nonhomogeneous media; Time domain analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

Antennas and Propagation Society International Symposium, 2002. IEEE

Print_ISBN

0-7803-7330-8

Type

conf

DOI

10.1109/APS.2002.1016950

Filename

1016950