• DocumentCode
    1940396
  • Title

    Thermal management of electronic and electrical devices in automobile environment

  • Author

    Nakayama, Wataru ; Suzuki, Osamu ; Hara, Yoshikatsu

  • Author_Institution
    ThermTech Int., Oh-Iso, Japan
  • fYear
    2009
  • fDate
    7-10 Sept. 2009
  • Firstpage
    601
  • Lastpage
    608
  • Abstract
    The Japanese industry has developed power electronics for railway trains, and now works to extend its experience to automobiles. The former part of the paper outlines the thermal issues pertinent to automobile applications as compared to railway applications. The discussion is developed for IGBT power modules and batteries. The latter part of the paper reviews the tools of thermal design analysis. A challenge to thermal design analysts is how to devise appropriate models of complex structures and thermal environment inside vehicles.
  • Keywords
    automotive electronics; insulated gate bipolar transistors; power supply circuits; thermal management (packaging); IGBT batteries; IGBT power modules; Japanese industry; automobile environment; electrical devices; electronic devices; railway trains; thermal design analysis; thermal environment; thermal management; Automobiles; Electronics industry; Environmental management; Industrial training; Insulated gate bipolar transistors; Multichip modules; Power electronics; Rail transportation; Thermal management; Thermal management of electronics; IGBT module; battery; computational fluid dynamics; electric vehicle; hybrid electric vehicle; lump modeling; thermal design;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Vehicle Power and Propulsion Conference, 2009. VPPC '09. IEEE
  • Conference_Location
    Dearborn, MI
  • Print_ISBN
    978-1-4244-2600-3
  • Electronic_ISBN
    978-1-4244-2601-0
  • Type

    conf

  • DOI
    10.1109/VPPC.2009.5289792
  • Filename
    5289792