DocumentCode
1940396
Title
Thermal management of electronic and electrical devices in automobile environment
Author
Nakayama, Wataru ; Suzuki, Osamu ; Hara, Yoshikatsu
Author_Institution
ThermTech Int., Oh-Iso, Japan
fYear
2009
fDate
7-10 Sept. 2009
Firstpage
601
Lastpage
608
Abstract
The Japanese industry has developed power electronics for railway trains, and now works to extend its experience to automobiles. The former part of the paper outlines the thermal issues pertinent to automobile applications as compared to railway applications. The discussion is developed for IGBT power modules and batteries. The latter part of the paper reviews the tools of thermal design analysis. A challenge to thermal design analysts is how to devise appropriate models of complex structures and thermal environment inside vehicles.
Keywords
automotive electronics; insulated gate bipolar transistors; power supply circuits; thermal management (packaging); IGBT batteries; IGBT power modules; Japanese industry; automobile environment; electrical devices; electronic devices; railway trains; thermal design analysis; thermal environment; thermal management; Automobiles; Electronics industry; Environmental management; Industrial training; Insulated gate bipolar transistors; Multichip modules; Power electronics; Rail transportation; Thermal management; Thermal management of electronics; IGBT module; battery; computational fluid dynamics; electric vehicle; hybrid electric vehicle; lump modeling; thermal design;
fLanguage
English
Publisher
ieee
Conference_Titel
Vehicle Power and Propulsion Conference, 2009. VPPC '09. IEEE
Conference_Location
Dearborn, MI
Print_ISBN
978-1-4244-2600-3
Electronic_ISBN
978-1-4244-2601-0
Type
conf
DOI
10.1109/VPPC.2009.5289792
Filename
5289792
Link To Document