Title :
Table of contents
Abstract :
The following topics are dealt with: design margin; ring oscillator; variability analysis; MEMS; process characterization; RF; parameter extraction; bonding stress; MOSFET matching and capacitance.
Keywords :
MOSFET; capacitance; micromechanical devices; oscillators; radiofrequency integrated circuits; stress analysis; MEMS; MOSFET; MOSFET matching; RF; bonding stress; capacitance; design margin; parameter extraction; process characterization; ring oscillator; variability analysis;
Conference_Titel :
Microelectronic Test Structures (ICMTS), 2012 IEEE International Conference on
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4673-1027-7
DOI :
10.1109/ICMTS.2012.6190599
