DocumentCode :
1941378
Title :
An embedded radio frequency sensor for application in an electrically non-conductive composite structure
Author :
Lindsey, Jefferson F., III ; Williams, David T.
Author_Institution :
Dept. of Technol., Southern Illinois Univ., Carbondale, IL, USA
Volume :
4
fYear :
2002
fDate :
2002
Firstpage :
382
Abstract :
Embedding a radio frequency sensor in the form of a balanced transmission line into an electrically non-conductive composite structure is investigated as a means of strain sensing and continuous lifetime testing. Initial experiments established that the reflection coefficient phase shift correlates to length changes in the transmission line using a printed circuit board having parallel copper lines. A transmission line consisting of flexible metal-coated fabric strips was then embedded in a composite sample. This sample was subjected to tensile strain and phase shift data and strain gauge data were collected. Correlations were found between load, phase shift and strain. Lastly, the printed circuit transmission line was used in an oscillator circuit for tuning. This experiment demonstrated that the capacitive effect of an open circuited transmission line could be used to vary the frequency of an oscillator. As the length of the transmission line was shortened, the frequency changed.
Keywords :
composite insulating materials; electric sensing devices; strain sensors; transmission lines; tuning; balanced transmission line; capacitive effect; continuous lifetime testing; electrically nonconductive composite structure; embedded radio frequency sensor; metal-coated fabric strips; oscillator circuit tuning; printed circuit board; reflection coefficient phase shift; strain gauge; strain sensing; tensile strain; Capacitive sensors; Circuit testing; Copper; Distributed parameter circuits; Flexible printed circuits; Life testing; Oscillators; Radio frequency; Reflection; Tensile strain;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Antennas and Propagation Society International Symposium, 2002. IEEE
Print_ISBN :
0-7803-7330-8
Type :
conf
DOI :
10.1109/APS.2002.1017002
Filename :
1017002
Link To Document :
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