A study on the thermal performance of a chip-in-substrate-type LED package structure

Light emitting diode (LED) has been widely applied in many products because of its low power consumption, low poluttion, and long operation lifetime. However, its low electron-optical conversion efficiency can induce a high percentage of input power that transforms into redundant heat, increasing the junction temperature. Based on the finite element (FE) analysis, we propose an effective methodology validated through the forward voltage method to design a new type of LED packaging structure. A chip-in-substrate-type structure is established by ANSYS^®. This structure is one of the possible solutions that can be employed in LED packaging, and it can be completed in a batch process. Using an effective methodology, the thermal performance of the chip-in-substrate-type structure under a specific power loading is realized. Furthermore, with regard to the design concepts of LED packaging, various parameters of the chip-in-substrate-type structure are investigated. The size of the heat sink has a significant influence on thermal performance.