DocumentCode :
19419
Title :
Linear-Complexity Direct and Iterative Integral Equation Solvers Accelerated by a New Rank-Minimized {cal H}^{2} -Representation for Large-Scale 3-D Interconnect Extraction
Author :
Wenwen Chai ; Dan Jiao
Author_Institution :
Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
Volume :
61
Issue :
8
fYear :
2013
fDate :
Aug. 2013
Firstpage :
2792
Lastpage :
2805
Abstract :
We develop a new rank-minimized H2-matrix-based representation of the dense system matrix arising from an integral-equation (IE)-based analysis of large-scale 3-D interconnects. Different from the H2-representation generated by the existing interpolation-based method, the new H2-representation minimizes the rank in nested cluster bases and all off-diagonal blocks at all tree levels based on accuracy. The construction algorithm of the new H2-representation is applicable to both real- and complex-valued dense matrices generated from scalar and/or vector-based IE formulations. It has a linear complexity, and hence, the computational overhead is small. The proposed new H2-representation can be employed to accelerate both iterative and direct solutions of the IE-based dense systems of equations. To demonstrate its effectiveness, we develop a linear-complexity preconditioned iterative solver as well as a linear-complexity direct solver for the capacitance extraction of arbitrarily shaped 3-D interconnects in multiple dielectrics. The proposed linear-complexity solvers are shown to outperform state-of-the-art H2-based linear-complexity solvers in both CPU time and memory consumption. A dense matrix resulting from the capacitance extraction of a 3-D interconnect having 3.71 million unknowns and 576 conductors is inverted in fast CPU time (1.6 h), modest memory consumption (4.4 GB), and with prescribed accuracy satisfied on a single core running at 3 GHz.
Keywords :
integral equations; integrated circuit interconnections; interpolation; iterative methods; matrix algebra; three-dimensional integrated circuits; arbitrarily shaped 3D interconnects; capacitance extraction; complex-valued dense matrices; construction algorithm; dense system matrix; direct solutions; frequency 3 GHz; integral-equation-based analysis; interpolation-based method; iterative integral equation solvers; iterative solution; large-scale 3D interconnect extraction; large-scale 3D interconnects; linear-complexity direct integral equation solvers; linear-complexity preconditioned iterative solver; memory consumption; nested cluster bases; off-diagonal blocks; rank-minimized H2-matrix-based representation; tree levels; ${cal H}^{2}$-matrix; Direct solver; fast solvers; integral-equation (IE)-based methods; interconnect extraction; iterative solver;
fLanguage :
English
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9480
Type :
jour
DOI :
10.1109/TMTT.2013.2268741
Filename :
6552210
Link To Document :
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