Title :
Here today, here tomorrow: challenges of recycling engineering thermoplastics
Author :
Biddle, Michael B. ; Christy, M. Robert
Author_Institution :
Dow Chemical Co., Walnut Creek, CA, USA
Abstract :
An overview of the solid waste issue is first presented, describing the following four components of an integrated approach to solid waste management: source reduction, energy recovery, landfilling, and recycling. A review of the components of recycling is presented, including collection, separation, characterization, compounding, upgrading, and application development. Considerations for closed-loop recycling for a specific application, plastic computer housings, are discussed. Ignition-resistance polycarbonate/acrylonitrile butadiene styrene (IR PC/ABS) blend resins are commonly used in electronic enclosures. Regrind studies were conducted on laboratory test specimens and plastic computer housings manufactured from PULSE 1725, a commercial grade of IR PC/ABS. Property retention and performance results are reported
Keywords :
environmental engineering; management; packaging; plastics; IR PC/ABS; PULSE 1725; closed-loop recycling; electronic enclosures; energy recovery; engineering thermoplastic recycling; ignition resistance resin; laboratory test specimens; landfilling; plastic computer housings; polycarbonate/acrylonitrile butadiene styrene blend resin; solid waste; solid waste management; Application software; Computer aided manufacturing; Computer applications; Laboratories; Plastics; Power engineering and energy; Recycling; Resins; Solids; Waste management;
Conference_Titel :
Electronics and the Environment, 1993., Proceedings of the 1993 IEEE International Symposium on
Conference_Location :
Arlington, VA
Print_ISBN :
0-7803-0829-8
DOI :
10.1109/ISEE.1993.302810
