DocumentCode
1942070
Title
Compact thermal-interaction model for dynamic within chip temperature determination by circuit simulation
Author
Ishiguro, K. ; Ueno, A. ; Toda, A. ; Miyake, M. ; Mattausch, H.J. ; Miura-Mattausch, M. ; Matsuzawa, K. ; Iizuka, T. ; Yamaguchi, S. ; Hoshida, T. ; Kinoshita, A. ; Arakawa, T.
Author_Institution
Grad. Sch. of Adv. Sci. of Matter, Hiroshima Univ., Higashi-Hiroshima, Japan
fYear
2012
fDate
19-22 March 2012
Firstpage
187
Lastpage
190
Abstract
We report an equivalent circuit for capturing the thermal propagation from a heat source, creating thermal energy by the self-heating effect, to other devices during circuit operation. It is verified that the equivalent circuit reproduces measured transient thermal propagation characteristics for different layouts. The test structures are also applied to extract the magnitude of the elements included in the equivalent circuit.
Keywords
circuit simulation; equivalent circuits; thermal analysis; chip temperature; circuit simulation; compact thermal-interaction model; equivalent circuit; heat source; self-heating effect; thermal energy; thermal propagation; Atmospheric measurements; Heating; Logic gates; Particle measurements; Receivers; Semiconductor device measurement; Temperature measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronic Test Structures (ICMTS), 2012 IEEE International Conference on
Conference_Location
San Diego, CA
ISSN
1071-9032
Print_ISBN
978-1-4673-1027-7
Type
conf
DOI
10.1109/ICMTS.2012.6190643
Filename
6190643
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