• DocumentCode
    1942070
  • Title

    Compact thermal-interaction model for dynamic within chip temperature determination by circuit simulation

  • Author

    Ishiguro, K. ; Ueno, A. ; Toda, A. ; Miyake, M. ; Mattausch, H.J. ; Miura-Mattausch, M. ; Matsuzawa, K. ; Iizuka, T. ; Yamaguchi, S. ; Hoshida, T. ; Kinoshita, A. ; Arakawa, T.

  • Author_Institution
    Grad. Sch. of Adv. Sci. of Matter, Hiroshima Univ., Higashi-Hiroshima, Japan
  • fYear
    2012
  • fDate
    19-22 March 2012
  • Firstpage
    187
  • Lastpage
    190
  • Abstract
    We report an equivalent circuit for capturing the thermal propagation from a heat source, creating thermal energy by the self-heating effect, to other devices during circuit operation. It is verified that the equivalent circuit reproduces measured transient thermal propagation characteristics for different layouts. The test structures are also applied to extract the magnitude of the elements included in the equivalent circuit.
  • Keywords
    circuit simulation; equivalent circuits; thermal analysis; chip temperature; circuit simulation; compact thermal-interaction model; equivalent circuit; heat source; self-heating effect; thermal energy; thermal propagation; Atmospheric measurements; Heating; Logic gates; Particle measurements; Receivers; Semiconductor device measurement; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronic Test Structures (ICMTS), 2012 IEEE International Conference on
  • Conference_Location
    San Diego, CA
  • ISSN
    1071-9032
  • Print_ISBN
    978-1-4673-1027-7
  • Type

    conf

  • DOI
    10.1109/ICMTS.2012.6190643
  • Filename
    6190643