DocumentCode :
1942114
Title :
Hole drilling of silica glass with infrared femtosecond laser pulses
Author :
Yan Li ; Itoh, Kenji ; Watanabe, Wataru
Author_Institution :
Venture Bus. Lab., Osaka Univ., Japan
Volume :
1
fYear :
2001
fDate :
15-19 July 2001
Abstract :
Using water to reduce the redeposition of ablation debris, high precision holes, with diameter of 4 /spl mu/m and depth over 200 /spl mu/m, were drilled from the rear surface of silica glass with infrared femtosecond laser pulses. The long holes with very small diameters had a well-defined wall without obvious taper.
Keywords :
laser ablation; laser beam machining; micromachining; optical fabrication; optical glass; 200 micron; 4 micron; ablation debris redeposition; depth; diameter; high precision holes; hole drilling; infrared femtosecond laser pulses; long holes; precision micromachining; rear surface; silica glass; transparent materials; water; well-defined wall; Drilling; Glass; Laser ablation; Laser theory; Optical filters; Optical materials; Optical microscopy; Optical pulses; Silicon compounds; Ultrafast optics;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Lasers and Electro-Optics, 2001. CLEO/Pacific Rim 2001. The 4th Pacific Rim Conference on
Conference_Location :
Chiba, Japan
Print_ISBN :
0-7803-6738-3
Type :
conf
DOI :
10.1109/CLEOPR.2001.967846
Filename :
967846
Link To Document :
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