• DocumentCode
    1942671
  • Title

    Asset cycle management-a total approach to product design for the environment

  • Author

    Berko-Boateng, V. ; Azar, J. ; de Jong, E. ; Yander, G.A.

  • Author_Institution
    Xerox Corp., Webster, NY, USA
  • fYear
    1993
  • fDate
    10-12 May 1993
  • Firstpage
    19
  • Lastpage
    31
  • Abstract
    The recycle process that is being employed by Xerox Corporation is described. The emphasis of the process is total asset recovery management. At Xerox Corporation, the commitment is to design products, modules and parts from the start of design to the remanufactured immediately following launch or for the materials to be totally recycled at the end-of-life of the product. The goal of the Asset Recovery Management Program is to achieve 0% material being dispositioned to the landfill in order to minimize the impact on the environment. The authors describe the implementation of this program by outlining the principles used throughout the product development cycle from the concept phase to design, production, launch, remanufacture, and final recycle. Some of the tools which enable total asset management are covered, including design guidelines, specifications, quality, reliability requirements, product conversion, life cycle analysis, and end-of-life disposal or material recycling
  • Keywords
    design engineering; electronic equipment manufacture; environmental engineering; management; reliability; asset recycle management; design guidelines; end-of-life disposal; environment; life cycle analysis; material recycling; product conversion; product design; product development cycle; quality; reliability requirements; specifications; total asset recovery management; Asset management; Environmental management; Manufacturing; Product design; Product development; Production; Recycling; Waste management; Waste materials; Waste reduction;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics and the Environment, 1993., Proceedings of the 1993 IEEE International Symposium on
  • Conference_Location
    Arlington, VA
  • Print_ISBN
    0-7803-0829-8
  • Type

    conf

  • DOI
    10.1109/ISEE.1993.302843
  • Filename
    302843