DocumentCode :
1942775
Title :
Dopant Redistribution from Ion Implanted WSi2 on Poly-Si
Author :
Nygren, S ; Levy, D. ; Goltz, G ; Torres, J.
Author_Institution :
C.N.E.T/C.N.S., Chemin du Vieux Chêne, BP 98, F-38243 Meylan, France; Royal institute of Technology, Solid State Electronics, S-10044 Stockholm, Sweden
fYear :
1987
fDate :
14-17 Sept. 1987
Firstpage :
483
Lastpage :
486
Abstract :
The possibility of doping the polycrystalline silicon in a polycide configuration by implantation into the silicide and subsequent thermal diffusion has been evaluated. In a first step it is demonstrated that a phosphorus implantation to a dose of 5E15 cm-2 into WSi2 can produce flatband voltages similar to those obtained by conventional diffusion doping into the polysilicon. This is true even if 2E15 cm¿2 boron is subsequently implanted. Secondly arsenic and boron implantations were tried with the aim to produce n-and p-doped gates respectively. Work function shifts between the two species approaching 1 Vindicate that typical source/drain implantations may be used for this purpose.
Keywords :
Annealing; Boron; CMOS technology; Conductivity; Doping; Geometry; Silicides; Silicon; Very large scale integration; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid State Device Research Conference, 1987. ESSDERC '87. 17th European
Conference_Location :
Bologna, Italy
Print_ISBN :
0444704779
Type :
conf
Filename :
5436823
Link To Document :
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