• DocumentCode
    1943504
  • Title

    Plasma processing

  • Author

    Graves, D.B.

  • Author_Institution
    Dept. of Chem. Eng., California Univ., Berkeley, CA, USA
  • fYear
    1993
  • fDate
    7-9 June 1993
  • Firstpage
    185
  • Abstract
    Summary form only given. The author discusses gas discharge plasmas and the development of plasmas as a key technology in materials processing. The focus is on the use of plasmas in electronic materials processing, especially etching of thin films. The author considers the range of problems that need to be addressed in this technology, with an emphasis on the role that plasma science can play in attacking problems that remain unresolved. An example of a problem faced by plasma process and design engineers is the rapid pace of process and plasma tool development, driven by short product development and cycle times in the industry. The author also presents some results from his own research group in the area of direct atomistic simulations of reactive plasma-surface interactions.
  • Keywords
    plasma applications; cycle times; design engineers; direct atomistic simulations; electronic materials processing; etching; gas discharge plasmas; materials processing; plasma science; plasma tool; plasmas; product development; reactive plasma-surface interactions; thin films; Design engineering; Discharges; Etching; Materials science and technology; Nuclear and plasma sciences; Plasma applications; Plasma materials processing; Plasma simulation; Process design; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Plasma Science, 1993. IEEE Conference Record - Abstracts., 1993 IEEE International Conference on
  • Conference_Location
    Vancouver, BC, Canada
  • ISSN
    0730-9244
  • Print_ISBN
    0-7803-1360-7
  • Type

    conf

  • DOI
    10.1109/PLASMA.1993.593511
  • Filename
    593511