DocumentCode
1943504
Title
Plasma processing
Author
Graves, D.B.
Author_Institution
Dept. of Chem. Eng., California Univ., Berkeley, CA, USA
fYear
1993
fDate
7-9 June 1993
Firstpage
185
Abstract
Summary form only given. The author discusses gas discharge plasmas and the development of plasmas as a key technology in materials processing. The focus is on the use of plasmas in electronic materials processing, especially etching of thin films. The author considers the range of problems that need to be addressed in this technology, with an emphasis on the role that plasma science can play in attacking problems that remain unresolved. An example of a problem faced by plasma process and design engineers is the rapid pace of process and plasma tool development, driven by short product development and cycle times in the industry. The author also presents some results from his own research group in the area of direct atomistic simulations of reactive plasma-surface interactions.
Keywords
plasma applications; cycle times; design engineers; direct atomistic simulations; electronic materials processing; etching; gas discharge plasmas; materials processing; plasma science; plasma tool; plasmas; product development; reactive plasma-surface interactions; thin films; Design engineering; Discharges; Etching; Materials science and technology; Nuclear and plasma sciences; Plasma applications; Plasma materials processing; Plasma simulation; Process design; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Plasma Science, 1993. IEEE Conference Record - Abstracts., 1993 IEEE International Conference on
Conference_Location
Vancouver, BC, Canada
ISSN
0730-9244
Print_ISBN
0-7803-1360-7
Type
conf
DOI
10.1109/PLASMA.1993.593511
Filename
593511
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