• DocumentCode
    1943557
  • Title

    Impact of Thickness and Deposition Temperature of Gate Dielectric on Valence Bands in Silicon Nanowires

  • Author

    Xu, Honghua ; He, Yuhui ; Fan, Chun ; Zhao, Yuning ; Du, Gang ; Kang, Jinfeng ; Han, Ruqi ; Liu, Xiaoyan

  • Author_Institution
    Key Lab. of Microelectron. Devices & Circuits, Peking Univ., Beijing, China
  • fYear
    2009
  • fDate
    9-11 Sept. 2009
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    The strain distribution and strained valence band structure in silicon nanowire with varied thicknesses and deposition temperatures of gate dielectric are discussed in detail in this work. Our calculation indicates that valence subbands are dependent on the structure and process parameters. Strain has little effects in (001) orientation. But in Si (110) nanowire, the valence subbands shift upper and warp remarkably as the gate dielectric becomes thicker. Taking thermal residual strain into consideration, the strained valence subbands go to higher energy positions compared to NW without the residual strain. The different deposition temperature by a certain process slightly influences the valence bands. Strain effects on densities of states and effective masses are also investigated.
  • Keywords
    dielectric materials; effective mass; electronic density of states; elemental semiconductors; hafnium compounds; nanowires; semiconductor quantum wires; silicon; silicon compounds; valence bands; Si-HfO2; Si-SiO2; densities of states; deposition temperature; effective masses; gate dielectrics; silicon nanowires; strain distribution; strain effects; strained valence band structure; thermal residual strain; valence subbands; Capacitive sensors; Dielectric devices; Effective mass; Hafnium oxide; Microelectronics; Nanowires; Silicon; Temperature distribution; Tensile strain; Thermal expansion;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation of Semiconductor Processes and Devices, 2009. SISPAD '09. International Conference on
  • Conference_Location
    San Diego, CA
  • ISSN
    1946-1569
  • Print_ISBN
    978-1-4244-3974-8
  • Electronic_ISBN
    1946-1569
  • Type

    conf

  • DOI
    10.1109/SISPAD.2009.5290203
  • Filename
    5290203