DocumentCode
1943557
Title
Impact of Thickness and Deposition Temperature of Gate Dielectric on Valence Bands in Silicon Nanowires
Author
Xu, Honghua ; He, Yuhui ; Fan, Chun ; Zhao, Yuning ; Du, Gang ; Kang, Jinfeng ; Han, Ruqi ; Liu, Xiaoyan
Author_Institution
Key Lab. of Microelectron. Devices & Circuits, Peking Univ., Beijing, China
fYear
2009
fDate
9-11 Sept. 2009
Firstpage
1
Lastpage
4
Abstract
The strain distribution and strained valence band structure in silicon nanowire with varied thicknesses and deposition temperatures of gate dielectric are discussed in detail in this work. Our calculation indicates that valence subbands are dependent on the structure and process parameters. Strain has little effects in (001) orientation. But in Si (110) nanowire, the valence subbands shift upper and warp remarkably as the gate dielectric becomes thicker. Taking thermal residual strain into consideration, the strained valence subbands go to higher energy positions compared to NW without the residual strain. The different deposition temperature by a certain process slightly influences the valence bands. Strain effects on densities of states and effective masses are also investigated.
Keywords
dielectric materials; effective mass; electronic density of states; elemental semiconductors; hafnium compounds; nanowires; semiconductor quantum wires; silicon; silicon compounds; valence bands; Si-HfO2; Si-SiO2; densities of states; deposition temperature; effective masses; gate dielectrics; silicon nanowires; strain distribution; strain effects; strained valence band structure; thermal residual strain; valence subbands; Capacitive sensors; Dielectric devices; Effective mass; Hafnium oxide; Microelectronics; Nanowires; Silicon; Temperature distribution; Tensile strain; Thermal expansion;
fLanguage
English
Publisher
ieee
Conference_Titel
Simulation of Semiconductor Processes and Devices, 2009. SISPAD '09. International Conference on
Conference_Location
San Diego, CA
ISSN
1946-1569
Print_ISBN
978-1-4244-3974-8
Electronic_ISBN
1946-1569
Type
conf
DOI
10.1109/SISPAD.2009.5290203
Filename
5290203
Link To Document