Current and future requirements in CAD for packaging of high performance systems

The introduction of a continuous series of complex electronic systems in today´s world would not be possible without the help of the sophisticated computer-aided-design (CAD) tools that have been developed over the past 25-30 years. In examining the requirements for future high performance systems, the need for a significant expansion of the scope and `intelligence´ of the CAD tools in the designing process becomes apparent. This is because of the greater interaction among conflicting mechanical, electrical, and thermal needs that will be posed by these systems. A few of the additional considerations that future CAD systems must embody are outlined