Title :
58th Electronic components & technology conference
Abstract :
The following topics are dealt with: IC integration; RF components; optical interconnections; IC packaging, IC stacking, IC planarisation; integrated passives devices; LEDs for lighting and display applications; thin-film LED array; through silicon via interconnects; manufacturing technology for advanced packages; package-on-package advanced assembly; drop impact reliability; biomedical and emerging technologies; nanowire-thin film bio-sensor integrated with microfluidic system; and wearable RFID-enabled sensor nodes for biomedical applications.
Keywords :
bioMEMS; biomedical electronics; biosensors; integrated circuit design; integrated circuit interconnections; integrated circuit manufacture; integrated circuit metallisation; integrated circuit packaging; integrated circuit reliability; light emitting diodes; microfluidics; nanoelectronics; nanotechnology; nanowires; power semiconductor devices; radiofrequency identification; silicon; solders; 3D silicon integration; IC integration; IC packaging; IC stacking; RF characterization modeling; RF components; drop impact reliability; high devices manufacturing techniques; high power devices; integrated microfluidic system; integrated passives devices; lead -free solders; manufacturing technology; nanowire-thin film bio-sensor; nonsolder first level interconnect; optical interconnections; package-on-package advanced assembly; thin-film LED array; through silicon via interconnects; wearable RFID-enabled sensor nodes;
Conference_Titel :
Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
Conference_Location :
Lake Buena Vista, FL
Print_ISBN :
978-1-4244-2230-2
DOI :
10.1109/ECTC.2008.4549928
