DocumentCode :
1943779
Title :
Foreword
fYear :
2008
fDate :
27-30 May 2008
Abstract :
Presents the introductory welcome message from the conference proceedings.
Keywords :
Assembly; Components, Packaging, and Manufacturing Technology Society; Components, packaging, and manufacturing technology; Electronic components; Electronic packaging thermal management; Electronics industry; Electronics packaging; Joining materials; Lakes; Meetings;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
Conference_Location :
Lake Buena Vista, FL
ISSN :
0569-5503
Print_ISBN :
978-1-4244-2230-2
Type :
conf
DOI :
10.1109/ECTC.2008.4549932
Filename :
4549932
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1943779
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