DocumentCode
1943779
Title
Foreword
fYear
2008
fDate
27-30 May 2008
Abstract
Presents the introductory welcome message from the conference proceedings.
Keywords
Assembly; Components, Packaging, and Manufacturing Technology Society; Components, packaging, and manufacturing technology; Electronic components; Electronic packaging thermal management; Electronics industry; Electronics packaging; Joining materials; Lakes; Meetings;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
Conference_Location
Lake Buena Vista, FL
ISSN
0569-5503
Print_ISBN
978-1-4244-2230-2
Type
conf
DOI
10.1109/ECTC.2008.4549932
Filename
4549932
Link To Document