Title :
Professional development courses for the 58th ECTC
Abstract :
Start of the above-titled section of the conference proceedings record.
Keywords :
CMOS technology; Components, packaging, and manufacturing technology; Electronic packaging thermal management; Electronics packaging; Environmentally friendly manufacturing techniques; Lead; Microelectronics; Semiconductor device packaging; Thermal conductivity; Wafer scale integration;
Conference_Titel :
Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
Conference_Location :
Lake Buena Vista, FL
Print_ISBN :
978-1-4244-2230-2
DOI :
10.1109/ECTC.2008.4549933
