DocumentCode
1943882
Title
Quantum Chemical Molecular Dynamics Study of Degradation Mechanism of Interface Integrity between a HfO2 Thin Film and a Metal Gate Electrode
Author
Inoue, Tatsuya ; Suzuki, Ken ; Miura, Hideo
Author_Institution
Grad. Sch. of Eng., Tohoku Univ., Sendai, Japan
fYear
2009
fDate
9-11 Sept. 2009
Firstpage
1
Lastpage
4
Abstract
Control of the interfacial crystallographic structure between a dielectric film and a gate electrode is one of the most critical issues for assuring the high performance and the reliability of a stacked MOS structure using high-k dielectric thin films. In this study, quantum chemical molecular dynamics was applied to explicate the mechanism of degradation of interfacial integrity of the gate stack systems which is caused by point defects. We found that point defects such as oxygen and carbon interstitials deteriorate the electronic quality of a hafnium dioxide film and the W/HfO2 interface structure. The estimated results were confirmed by experiments using synchrotron-radiation photoemission spectroscopy.
Keywords
MIS structures; crystallography; electrodes; hafnium compounds; high-k dielectric thin films; interface structure; interstitials; metallic thin films; molecular dynamics method; photoelectron spectra; synchrotron radiation; tungsten; W-HfO2; carbon interstitials; electronic quality; gate stack system; high-k dielectric thin film; interface structure; interfacial crystallographic structure; metal gate electrode; oxygen interstitials; point defects; quantum chemical molecular dynamics method; reliability; stacked MOS structure; synchrotron-radiation photoemission spectroscopy; thin film; Chemicals; Crystallography; Degradation; Dielectric films; Dielectric thin films; Electrodes; Hafnium oxide; High-K gate dielectrics; Photoelectricity; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Simulation of Semiconductor Processes and Devices, 2009. SISPAD '09. International Conference on
Conference_Location
San Diego, CA
ISSN
1946-1569
Print_ISBN
978-1-4244-3974-8
Electronic_ISBN
1946-1569
Type
conf
DOI
10.1109/SISPAD.2009.5290215
Filename
5290215
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