Low power current mode multi-valued logic interconnect for high speed interchip communications

Author

Zhang, J.Q. ; Long, S.I. ; Ho, F.H. ; Madsen, J.K.

Author_Institution

Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA

fYear

1995

fDate

Oct. 29 1995-Nov. 1 1995

Firstpage

327

Lastpage

330

Abstract

A new GaAs current mode (CM) chip-to-chip interconnection circuit is presented that provides high signal transfer speed with a 50 /spl Omega/ active termination and reduced input voltage swing. The power dissipation is shown to be 1/8 of an ECL I/O. The ternary logic version of it can reduce wiring by half and eliminate clock skew problems while still keeping the low power dissipation.

Keywords

III-V semiconductors; field effect logic circuits; gallium arsenide; integrated circuit interconnections; multivalued logic; multivalued logic circuits; ternary logic; GaAs; chip-to-chip interconnection circuit; current mode MVL; high signal transfer speed; high speed interchip communications; low power operation; multivalued logic interconnect; power dissipation; ternary logic version; Clocks; Driver circuits; Gallium arsenide; Impedance; Integrated circuit interconnections; Multivalued logic; Power dissipation; Power transmission lines; Termination of employment; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Gallium Arsenide Integrated Circuit (GaAs IC) Symposium, 1995. Technical Digest 1995., 17th Annual IEEE

Conference_Location

San Diego, CA, USA

Print_ISBN

0-7803-2966-X

Type

conf

DOI

10.1109/GAAS.1995.529022

Filename

529022