Title :
Copper Microstructure Impact on Evolution of Electromigration Induced Voids
Author :
Ceric, Hajdin ; De Orio, Roberto Lacerda ; Cervenka, Johann ; Selberherr, Siegfried
Author_Institution :
Inst. for Microelectron., Tech. Univ. Wien, Vienna, Austria
Abstract :
We study the impact of microstructure on nucleation and evolution of electromigration induced voids. The grain boundaries are described with a comprehensive model which includes the dynamics of mobile and immobile vacancies in dependence of mechanical stress. The surface of an evolving void is modeled by a three-dimensional level-set algorithm. Simulations have shown that the constellation of grain boundaries determines the electromigration failure behavior seriously.
Keywords :
copper; electromigration; grain boundaries; nucleation; vacancies (crystal); voids (solid); Cu; copper microstructure impact; electromigration failure property; electromigration induced voids; grain boundaries; immobile vacancies; mechanical stress; mobile vacancies; nucleation; three-dimensional level-set algorithm; Circuit simulation; Copper; Electromigration; Equations; Grain boundaries; Integrated circuit interconnections; Microelectronics; Microstructure; Surface morphology; Tensile stress;
Conference_Titel :
Simulation of Semiconductor Processes and Devices, 2009. SISPAD '09. International Conference on
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4244-3974-8
Electronic_ISBN :
1946-1569
DOI :
10.1109/SISPAD.2009.5290222
