Title :
CAD Based Interconnect Analysis
Author_Institution :
Implementation Group, Synopsys, Mountain View, CA, USA
Abstract :
This paper provides an introduction and overview of interconnect modeling in integrated circuits. Resistance, capacitance, inductance and mechanical analysis are discussed.
Keywords :
circuit CAD; electronic engineering computing; integrated circuit design; integrated circuit interconnections; integrated circuit reliability; CAD based interconnect analysis; IC design process; capacitance extraction; inductance; integrated circuit interconnects modeling; interconnect reliability; mechanical analysis; resistance extraction; Capacitance measurement; Conductors; Copper; Dielectric materials; Etching; Inductance; Integrated circuit interconnections; Integrated circuit modeling; Parasitic capacitance; Silicon;
Conference_Titel :
Simulation of Semiconductor Processes and Devices, 2009. SISPAD '09. International Conference on
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4244-3974-8
Electronic_ISBN :
1946-1569
DOI :
10.1109/SISPAD.2009.5290223
