• DocumentCode
    1944090
  • Title

    CAD Based Interconnect Analysis

  • Author

    Rollins, J.G.

  • Author_Institution
    Implementation Group, Synopsys, Mountain View, CA, USA
  • fYear
    2009
  • fDate
    9-11 Sept. 2009
  • Firstpage
    1
  • Lastpage
    7
  • Abstract
    This paper provides an introduction and overview of interconnect modeling in integrated circuits. Resistance, capacitance, inductance and mechanical analysis are discussed.
  • Keywords
    circuit CAD; electronic engineering computing; integrated circuit design; integrated circuit interconnections; integrated circuit reliability; CAD based interconnect analysis; IC design process; capacitance extraction; inductance; integrated circuit interconnects modeling; interconnect reliability; mechanical analysis; resistance extraction; Capacitance measurement; Conductors; Copper; Dielectric materials; Etching; Inductance; Integrated circuit interconnections; Integrated circuit modeling; Parasitic capacitance; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation of Semiconductor Processes and Devices, 2009. SISPAD '09. International Conference on
  • Conference_Location
    San Diego, CA
  • ISSN
    1946-1569
  • Print_ISBN
    978-1-4244-3974-8
  • Electronic_ISBN
    1946-1569
  • Type

    conf

  • DOI
    10.1109/SISPAD.2009.5290223
  • Filename
    5290223
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1944090