Title :
A scheme of array memory stacking to the multi-channel solid state disk (SSD) applications: High speed, high reliability, and green compliance
Author :
Shen, Li-Cheng ; Chen, Wen-Chih ; Hung, Yin-Po ; Yang, Tsung-Fu ; Leu, Fang-Jun ; Chang, Tao-Chih
Author_Institution :
Electron. & Optoelectron. Res. Lab. (EOL), Ind. Technol. Res. Inst. (ITRI), Hsinchu
Abstract :
In this paper, a construction of 3D array memory module based on chip-on-film (COF) bonding and carrier stacking is developed. Experimental results are demonstrated on an 1.8" HDD-identical platform, where the total thickness of the stacked 3D array memory module of 8 chips X 8 layers is less than 2 mm at 1.8"-HDD area. All materials to implement this 3D array memory for SSD are lead-free and halogen-free.
Keywords :
bonding processes; disc drives; hard discs; 3D array memory module construction; HDD-identical platform; array memory stacking scheme; chip-on-film bonding; multichannel solid state disk; Assembly; Bonding; Environmentally friendly manufacturing techniques; Industrial electronics; Laboratories; Modular construction; Packaging; SDRAM; Solid state circuits; Stacking;
Conference_Titel :
Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
Conference_Location :
Lake Buena Vista, FL
Print_ISBN :
978-1-4244-2230-2
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2008.4549946
