DocumentCode :
1944338
Title :
Wafer Bonding Technology for Soi Applications: A Review
Author :
Mitani, Kiyoshi ; Abe, Takao
Author_Institution :
Shin-Etsu Handotai R&D, Japan
fYear :
1992
fDate :
6-8 Oct. 1992
Firstpage :
18
Lastpage :
19
Keywords :
Annealing; Chemical technology; Etching; Fabrication; Infrared detectors; MOSFET circuits; Silicon; Temperature; Ultrasonic variables measurement; Wafer bonding;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
SOI Conference, 1992. IEEE International
Conference_Location :
Ponte Vedra Beach, FL
ISSN :
1078-621X
Print_ISBN :
0-7803-7439-8
Type :
conf
DOI :
10.1109/SOI.1992.664775
Filename :
664775
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1944338
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