Title :
The effects of aging temperature on SAC solder joint material behavior and reliability
Author :
Zhang, Yifei ; Cai, Zijie ; Suhling, Jeffrey C. ; Lall, Pradeep ; Bozack, Michael J.
Author_Institution :
Center for Adv. Vehicle Electron., Auburn Univ., Auburn, AL
Abstract :
The effects of aging on mechanical behavior of lead free solders have been examined by performing creep tests on four different SAC alloys (SAC105, SAC205, SAC305, SAC405) that were aged for various durations (0-4 months) at room temperature (25degC), and several elevated temperatures (75, 100, and 125 degC). Analogous tests were performed with 63Sn-37Pb eutectic solder samples for comparison purposes. Variations of the creep properties were observed and modeled as a function of aging time and aging temperature. In addition, the chosen selection of SAC alloys has allowed us to explore the effects of silver content on aging behavior.
Keywords :
ageing; copper alloys; creep testing; failure (mechanical); reliability; shear strength; silver alloys; solders; tin alloys; 63Sn-37Pb eutectic solder comparison; SAC solder joint material behavior; SAC solder joint reliability; SnAgCu; aging temperature effects; analogous tests; creep properties variations; creep tests; lead free solders; temperature 100 C; temperature 125 C; temperature 25 C; temperature 75 C; time 0 month to 4 month; Aging; Creep; Environmentally friendly manufacturing techniques; Joining materials; Lead; Materials reliability; Performance evaluation; Soldering; Temperature; Testing;
Conference_Titel :
Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
Conference_Location :
Lake Buena Vista, FL
Print_ISBN :
978-1-4244-2230-2
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2008.4549956
