A stitching technique for expanding large 3-D multi-layer antenna arrays in Ku-band using small array units

This paper presents an approach, where via technology is used to expand an antenna array by "stitching" two unit arrays. This method becomes useful as the processing capability becomes limited by the size of the antenna array. Using the bonding process of liquid crystal polymer (LCP), a 3D multi-layer 4times8 patch antenna array has been created and measured at 14 GHz. The results are compared to a single layer structure without vias. The measurement shows SI 1 of -19.1 dB at 13.9 GHz for the multilayer design with a via.