DocumentCode :
1944681
Title :
Novel low-cost on-chip CPW slow-wave structure for compact RF components and mm-wave applications
Author :
Wang, Guoan ; Woods, Wayne ; Ding, Hanyi ; Mina, Essam
Author_Institution :
IBM Semicond. R&D Center, Essex Junction, VT
fYear :
2008
fDate :
27-30 May 2008
Firstpage :
186
Lastpage :
190
Abstract :
In this paper, an ideal slow wave coplanar waveguide (CPW) structures with low losses, moderate impedance and CMOS fabrication technology have been developed. The slow wave CPW transmission line structures were achieved through IBM 0.13 mum technology with multi-layer metals. The CPW were implemented with narrower signal line or wider separation between signal and ground plane to increase the inductance per unit length, while metal strips on another metal layers cross under/above the CPW lines, which are orthogonal to signal propagation direction. Losses reduction using via bars to increase the thickness of the signal metal layer, structures with metal strip options (above, under and both CPW) to increase the capacitance per unit length of the CPW and provide more flexibility for the proposed structure, effect of the metal strips pitch are also discussed. The slow wave structure discussed in this paper can shrink the side dimension of the mm-wave passive components by up to 35%.
Keywords :
CMOS integrated circuits; coplanar waveguides; millimetre wave devices; strip line components; CMOS fabrication technology; capacitance per unit length; compact RF components; coplanar waveguide; metal strips pitch; millimetrewave applications; signal metal layer; size 0.13 mum; slow-wave structure; Bars; CMOS technology; Capacitance; Coplanar transmission lines; Coplanar waveguides; Impedance; Inductance; Optical device fabrication; Radio frequency; Strips;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
Conference_Location :
Lake Buena Vista, FL
ISSN :
0569-5503
Print_ISBN :
978-1-4244-2230-2
Electronic_ISBN :
0569-5503
Type :
conf
DOI :
10.1109/ECTC.2008.4549968
Filename :
4549968
Link To Document :
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