DocumentCode
1944941
Title
10-Gb/s × 12-ch downsized optical modules with electrical conductive film connector
Author
Suzuki, Atsushi ; Ishikawa, Takaaki ; Wakazono, Yoshitsugu ; Nagao, Daisuke ; Hino, Tomoyuki ; Hashimoto, Yoichi ; Masuda, Hiroshi ; Suzuki, Shuji ; Tamura, Mitsuaki ; Suzuki, Tei-ichi ; Kikuchi, Katsuya ; Okada, Yoshikuni ; Nakagawa, Hiroshi ; Aoyaghi, M
Author_Institution
Nanoelectron. Res. Inst., Nat. Inst. of Adv. Ind. Sci. & Technol., Tsukuba
fYear
2008
fDate
27-30 May 2008
Firstpage
250
Lastpage
255
Abstract
We demonstrate 10-Gb/s/ch operations of high-density, low-cost 12-channel optical modules for optical interconnections. These optical modules that we developed are designed to be pluggable into cards with an electrical connector. These pluggable modules will enable cards to be manufactured much more easily since they allow the manufacturing processes of optical modules and cards to be separated. An electrical connector with a clamp spring is used to connect a ceramic substrate with a printed circuit board (PCB). An anisotropic conductive film (ACF) is used to transmit electrical signals between the ceramic substrate and the PCB. To achieve optical coupling, optical fibers are butt-coupled with optical devices mounted in a cavity on the ceramic substrate. Alignment between the twelve optical fibers and the 12-channel optical device is achieved using guide pins fabricated in the ceramic substrate and guide holes fabricated in the optical connector.
Keywords
cavity resonators; optical couplers; optical fibres; optical films; optical interconnections; printed circuits; 12-channel optical modules; PCB; anisotropic conductive film; bit rate 10 Gbit/s; butt-coupled; ceramic substrate; clamp spring; downsized optical modules; electrical conductive film connector; guide holes; guide pins; optical coupling; optical devices; optical fibers; optical interconnections; pluggable modules; printed circuit board; Ceramics; Conductive films; Connectors; Manufacturing processes; Optical design; Optical devices; Optical fibers; Optical films; Optical interconnections; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
Conference_Location
Lake Buena Vista, FL
ISSN
0569-5503
Print_ISBN
978-1-4244-2230-2
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2008.4549978
Filename
4549978
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