DocumentCode
1944956
Title
Flexible opto-electronic circuit board for in-device interconnection
Author
Shibata, Tomoaki ; Takahashi, Atsushi
Author_Institution
Adv. Mater. R&D Center, Hitachi Chem. Co. Ltd., Tsukuba
fYear
2008
fDate
27-30 May 2008
Firstpage
261
Lastpage
267
Abstract
We propose a flexible opto-electronic circuit board (FOECB) for in-device interconnection, which is combined with a flexible printed circuit (FPC) with flexible optical waveguides having 45deg mirrors for 90deg beam turning using adhesive film. The fabricated prototype shows total optical loss of 3.7 dB, and the prototype, which mounted a 4-ch vertical-cavity surface-emitting laser (VCSEL) array and a 4-ch photodiode (PD) array, successfully demonstrated optical signal transmission at a data rate of 10 Gbps/ch. These results show that the proposed prototype has considerable potential to realize practical FOECB for in-device interconnection.
Keywords
interconnections; optical losses; optical waveguides; photodiodes; printed circuits; adhesive film; beam turning; flexible optical waveguides; flexible opto-electronic circuit board; flexible printed circuit; in-device interconnection; optical loss; optical signal transmission; photodiode array; vertical-cavity surface-emitting laser array; Flexible printed circuits; Integrated circuit interconnections; Laser beams; Mirrors; Optical arrays; Optical films; Optical interconnections; Optical waveguides; Prototypes; Vertical cavity surface emitting lasers;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
Conference_Location
Lake Buena Vista, FL
ISSN
0569-5503
Print_ISBN
978-1-4244-2230-2
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2008.4549980
Filename
4549980
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