• DocumentCode
    1944956
  • Title

    Flexible opto-electronic circuit board for in-device interconnection

  • Author

    Shibata, Tomoaki ; Takahashi, Atsushi

  • Author_Institution
    Adv. Mater. R&D Center, Hitachi Chem. Co. Ltd., Tsukuba
  • fYear
    2008
  • fDate
    27-30 May 2008
  • Firstpage
    261
  • Lastpage
    267
  • Abstract
    We propose a flexible opto-electronic circuit board (FOECB) for in-device interconnection, which is combined with a flexible printed circuit (FPC) with flexible optical waveguides having 45deg mirrors for 90deg beam turning using adhesive film. The fabricated prototype shows total optical loss of 3.7 dB, and the prototype, which mounted a 4-ch vertical-cavity surface-emitting laser (VCSEL) array and a 4-ch photodiode (PD) array, successfully demonstrated optical signal transmission at a data rate of 10 Gbps/ch. These results show that the proposed prototype has considerable potential to realize practical FOECB for in-device interconnection.
  • Keywords
    interconnections; optical losses; optical waveguides; photodiodes; printed circuits; adhesive film; beam turning; flexible optical waveguides; flexible opto-electronic circuit board; flexible printed circuit; in-device interconnection; optical loss; optical signal transmission; photodiode array; vertical-cavity surface-emitting laser array; Flexible printed circuits; Integrated circuit interconnections; Laser beams; Mirrors; Optical arrays; Optical films; Optical interconnections; Optical waveguides; Prototypes; Vertical cavity surface emitting lasers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
  • Conference_Location
    Lake Buena Vista, FL
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-4244-2230-2
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2008.4549980
  • Filename
    4549980