Title :
Reliability studies of Sn-Ag-Cu BGA solder joints on Ni/Cu/Au surface finish for SMAFTI packaging technology
Author :
Kawashiro, Fumiyoshi ; Ujiie, Masato ; Shibuya, Koujirou ; Kurita, Yoichiro ; Soejima, Koji ; Kawano, Masaya
Author_Institution :
NEC Electron. Corp., Sagamihara
Abstract :
A novel pad metal stack structure for wafer-level 3-D packaging technology with fine and thin interposer is proposed. The purpose of this paper is to investigate the solder joint performance of SMAFTI (smart chip connection with feedthrough interposer) under impact shear test and board level reliability test. Using the prototype samples of SMAFTI packages, impact shear tests are performed, which show Sn-Ag-Cu solder joints on Ni/Cu/Au surface are superior to those on Ni/Au. Thermal cycle test, bending cyclic test and drop test are conducted to evaluate the fatigue life of this package. The 0.1% Weibull life of thermal cycle is 989 cycles, and the life cycles of more than 20,000 and 10 cycles are obtained for cyclic bending and drop tests, respectively.
Keywords :
ball grid arrays; circuit reliability; copper alloys; silver alloys; solders; thermal analysis; tin alloys; wafer level packaging; Au; BGA solder joints; Cu; Ni; SMAFTI packaging technology; Sn-Ag-Cu; bending cyclic test; board level reliability test; drop test; shear test; smart chip connection with feedthrough interposer; thermal cycle test; wafer-level 3D packaging technology; Fatigue; Gold; Life testing; Packaging; Performance evaluation; Prototypes; Soldering; Surface finishing; Thermal conductivity; Wafer scale integration;
Conference_Titel :
Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
Conference_Location :
Lake Buena Vista, FL
Print_ISBN :
978-1-4244-2230-2
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2008.4549983
