• DocumentCode
    1945375
  • Title

    0.075 × 0.075 mm2 ultra-small 7.5 μm ultra-thin RFID-chip mounting technology

  • Author

    Noda, Hideyuki ; Usami, Mitsuo

  • Author_Institution
    Central Res. Lab., Hitachi, Ltd., Tokyo
  • fYear
    2008
  • fDate
    27-30 May 2008
  • Firstpage
    366
  • Lastpage
    370
  • Abstract
    An ultra-small (0.075x0.075-mm area) ultra-thin (7.5-mum thickness) radio-frequency identification (RFID) chip, called a "mu-chip," is expected to be adopted in applications like counterfeit prevention and product tracking of paper media and other small goods. For adoption in these applications, technology for mounting a mu-chip on an external antenna must be developed. Accordingly, we have developed a new technique for handling ultra-small mu-chips (called the "UH technique") by means of an automated apparatus. By the UH technique, the mu-chips are kept dispersed by liquid agitation, and only a single chip is captured and manipulated by micropipette. The efficiency of capturing a single mu-chip depends on the micropipette configuration, number of chips, and mu-chip stock solutions. A flat-end glass capillary micropipette with an inner and outer diameter of, respectively, 41 and 87 mum, which was treated by an optic-fiber cleaver, only successfully captured a single chip with an ideal orientation. The yield rate of capturing a single mu-chip, picked up from various types of liquid solutions, was investigated. This investigation found that a surfactant addition to the mu-chip stock solutions effectively prevented sticking between chips. In single-chip capturing performed in 0.5% NP-40, yield rate was 62%. Mounting of single mu-chips on films with constant 0.7-mm pitch was demonstrated. The time needed for an automated procedure for manipulating 100 chips was 44 min (26.4 s/chip).
  • Keywords
    integrated circuit technology; radiofrequency identification; flat-end glass capillary micropipette; liquid agitation; mu-chip; optic-fiber cleaver; ultra-small ultra-thin radio-frequency identification chip; ultra-thin RFID-chip mounting technology; Atmosphere; CMOS technology; Costs; Counterfeiting; Electrodes; Fabrication; Radio frequency; Radiofrequency identification; Shape control; Silicon on insulator technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
  • Conference_Location
    Lake Buena Vista, FL
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-4244-2230-2
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2008.4549997
  • Filename
    4549997