DocumentCode
1945449
Title
An Optimum Design Method for Nonlinear System Using an Improved Neural Network
Author
Miao, Cai ; Dao-guo, Yang ; WenBin, Chen ; Quan-yong, Li
Author_Institution
Guangxi Key Lab. of Manuf. Syst. & Adv. Manuf. Technol., Guilin Univ. of Electron. Technol., Guilin
Volume
1
fYear
2008
fDate
12-14 Dec. 2008
Firstpage
94
Lastpage
97
Abstract
The optimization design for a complex nonlinear system is difficult to be achieved by using the traditional methods. This paper presents an optimization design method for nonlinear system by using an improved neural network. The proposed approach is a combination of error back-propagation neural network (BPNN), principal component analysis (PCA) and genetic algorithms (GAs). PCA is employed to reduce the dimension and de-noise for the learning matrix of BPNN model. A combination of GAs and the BPNN model is used to find the most appropriate linking weight with its global search feature. As a demonstration example, the optimization method for selecting the material and dimension parameters for a QFN package is explored. Firstly, in order to search for the optimal parameter combination, the well-trained network model, which includes a nonlinear function of the input parameters and corresponding outputs, is considered as an observation tool to select optimal parameter size as to reduce the J-integral value of interface cracking in the packaging device. Secondly, the optimal parameter combinations are selected for the device after verification. The results from the optimization design show that the well-trained PCA-GA-BPNN model using the proposed approach can be used in the optimization design of the microelectronics packaging device to reduce the interface delamination problems.
Keywords
backpropagation; electronic engineering computing; genetic algorithms; integrated circuit packaging; neural nets; nonlinear systems; principal component analysis; BPNN; PCA; back-propagation neural network; complex nonlinear system; genetic algorithms; global search feature; interface cracking; interface delamination problems; learning matrix; microelectronics packaging device; neural network; nonlinear function; optimum design method; principal component analysis; Design methodology; Design optimization; Genetic algorithms; Joining processes; Microelectronics; Neural networks; Nonlinear systems; Optimization methods; Packaging; Principal component analysis; BP neural network (BPNN); combination; delamination; microelectronic packaging; optimum design method;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer Science and Software Engineering, 2008 International Conference on
Conference_Location
Wuhan, Hubei
Print_ISBN
978-0-7695-3336-0
Type
conf
DOI
10.1109/CSSE.2008.1202
Filename
4721700
Link To Document