Title :
Effects of different surfactant additions and treatments on the characteristics of tin nanosolder by chemical reduction method
Author :
Huang, Po-Chun ; Duh, Jenq-Gong
Author_Institution :
Dept. of Mater. Sci. & Eng., Nat. Tsing Hua Univ., Hsinchu
Abstract :
In this study, tin nanoparticles with different surfactant type and concentration were synthesized by chemical reduction method. The precursor (SnCl2) and reductant (NaBH4) in different beaker were drop by drop trickled into one beaker with DI water to synthesize tin nanoparticles. These tin nanoparticles were characterized by high resolution transmission electron microscopy (HRTEM), field emission microscopy (FE-SEM), and other related techniques. For different surfactant type and concentration, tin nanoparticles exhibited various particles characteristics. Effects of different surfactant addition on the characteristics of tin nanosolder were discussed.
Keywords :
field emission; nanoparticles; solders; tin alloys; Sn; chemical reduction; field emission microscopy; high resolution transmission electron microscopy; surfactant additions; surfactant treatments; tin nanoparticles; tin nanosolder; Chemical engineering; Electron emission; Electronics packaging; Environmentally friendly manufacturing techniques; Lead; Nanoparticles; Nanotechnology; Temperature; Tin alloys; Transmission electron microscopy;
Conference_Titel :
Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
Conference_Location :
Lake Buena Vista, FL
Print_ISBN :
978-1-4244-2230-2
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2008.4550007