Planar fabrication of multilayer piezoelectric actuator by groove cutting and electroplating

Author

Suzuki, Gaku ; Esashi, Masayoshi

Author_Institution

Venture Bus. Lab., Tohoku Univ., Sendai, Japan

fYear

2000

fDate

23-27 Jan 2000

Firstpage

46

Lastpage

51

Abstract

This paper reports a new planar fabrication method of multilayer piezoelectric actuator. In this method, three techniques, dicing, electroplating and laser assisted etching (LAE), were used for constructing the multilayer structure. Prototype actuators with 23-120 active layers were fabricated in this method. The measured displacement was 2.5 μm (23 layers) and 7.3 μm (120 layers) at 100 V, respectively. These values agree with the calculated values from the piezoelectric properties of the material

Keywords

cutting; electroplating; laser beam etching; laser beam machining; microactuators; micromachining; multilayers; piezoelectric actuators; 100 V; bending displacement; deep grooves; dicing; electroplating; groove cutting; laser assisted etching; mechanism integrated actuators; multilayer piezoelectric actuator; planar fabrication; small actuator arrays; stacked actuators; tactile display; Ceramics; Electrodes; Etching; Low voltage; Metalworking machines; Nonhomogeneous media; Optical device fabrication; Piezoelectric actuators; Switches; Tape casting;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems, 2000. MEMS 2000. The Thirteenth Annual International Conference on

Conference_Location

Miyazaki

ISSN

1084-6999

Print_ISBN

0-7803-5273-4

Type

conf

DOI

10.1109/MEMSYS.2000.838488

Filename

838488