Title : 
Novel bus termination schemes to reduce IO power consumption on low power intel small form factor platforms
         
        
            Author : 
Das, Ripan ; Iyer, Jayesh ; Suchitha, V. ; Praveen K, Y. ; Ti Tran, Minh ; Thomas, Shanto A. ; Gupta, Sanjeev K. ; Kraipak, Wasim
         
        
            Author_Institution : 
Intel Technol. India Pvt Ltd., Bangalore
         
        
        
        
        
        
            Abstract : 
In small form factor (SFF) platforms, motherboard space, and power are some of the most critical factors for their design. System memory bus is one of the major contributors to the I/O power consumption. Historically, the memory bus has always been terminated on the motherboard at the receiver end to meet Si/timing requirements. But these terminations result in significant power dissipation. This paper investigates the impact of removing these terminations [No-ODT (on die termination) for data/strobe and No-Rtt-parallel termination for command/control (CMD/CNTL) for different memory configurations], and provides motherboard routing recommendations to support No-ODT/No-Rtt without violating SI/timing specs. This paper also highlights the savings in power and motherboard space achieved by removing these terminations.
         
        
            Keywords : 
input-output programs; power consumption; system buses; IO power consumption; Si/timing requirements; bus termination; command-control; die termination; low power intel; motherboard routing; motherboard space; power dissipation; small form factor platforms; system memory bus; Batteries; Energy consumption; Handheld computers; Power dissipation; Resistors; Routing; Silicon; Space technology; Timing; Topology;
         
        
        
        
            Conference_Titel : 
Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
         
        
            Conference_Location : 
Lake Buena Vista, FL
         
        
        
            Print_ISBN : 
978-1-4244-2230-2
         
        
            Electronic_ISBN : 
0569-5503
         
        
        
            DOI : 
10.1109/ECTC.2008.4550022