• DocumentCode
    1946047
  • Title

    An audio frequency filter application of micromachined thermally-isolated diaphragm structures

  • Author

    Lee, Kwang-Hyun ; Byun, Hee-Jin ; Lee, Hyung-Kew ; Cho, Il-Joo ; Bu, Jong-Uk ; Yoon, Euisik

  • Author_Institution
    Dept. of Electr. Eng., Korea Adv. Inst. of Sci. & Technol., Taejon, South Korea
  • fYear
    2000
  • fDate
    23-27 Jan 2000
  • Firstpage
    142
  • Lastpage
    147
  • Abstract
    This paper reports a new application of micromachined thermally-isolated diaphragm structures for audio frequency filters. We have used a pair of electrothermal elements that consist of a heater and a temperature sensor integrated in the same dielectric diaphragm for a good thermal coupling. The filters using the fabricated electrothermal structures with driving circuitry have been tested. Measured responses of the filters show that a cutoff frequency can be electrically tuned ranging from 30 Hz to 300 Hz. Design parameters with respect to filter characteristics have been analyzed and design guidelines have been identified. The results have demonstrated the possibility that the thermally-isolated diaphragm structures can be used for audio frequency filter applications
  • Keywords
    band-pass filters; circuit tuning; diaphragms; etching; harmonic distortion; isolation technology; low-pass filters; micromachining; micromechanical devices; 30 to 300 Hz; ONO membrane; audio frequency filters; band-pass filters; design parameters; dynamic range; electrothermal elements; etch window patterning; heater; loop filters; low-pass characteristics; micromachined structures; temperature sensor; thermal coupling; thermally-isolated diaphragm structures; tunable cutoff frequency; Circuit testing; Coupling circuits; Cutoff frequency; Dielectric measurements; Electric variables measurement; Electrothermal effects; Filters; Frequency measurement; Integrated circuit measurements; Temperature sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2000. MEMS 2000. The Thirteenth Annual International Conference on
  • Conference_Location
    Miyazaki
  • ISSN
    1084-6999
  • Print_ISBN
    0-7803-5273-4
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2000.838505
  • Filename
    838505