DocumentCode
1946047
Title
An audio frequency filter application of micromachined thermally-isolated diaphragm structures
Author
Lee, Kwang-Hyun ; Byun, Hee-Jin ; Lee, Hyung-Kew ; Cho, Il-Joo ; Bu, Jong-Uk ; Yoon, Euisik
Author_Institution
Dept. of Electr. Eng., Korea Adv. Inst. of Sci. & Technol., Taejon, South Korea
fYear
2000
fDate
23-27 Jan 2000
Firstpage
142
Lastpage
147
Abstract
This paper reports a new application of micromachined thermally-isolated diaphragm structures for audio frequency filters. We have used a pair of electrothermal elements that consist of a heater and a temperature sensor integrated in the same dielectric diaphragm for a good thermal coupling. The filters using the fabricated electrothermal structures with driving circuitry have been tested. Measured responses of the filters show that a cutoff frequency can be electrically tuned ranging from 30 Hz to 300 Hz. Design parameters with respect to filter characteristics have been analyzed and design guidelines have been identified. The results have demonstrated the possibility that the thermally-isolated diaphragm structures can be used for audio frequency filter applications
Keywords
band-pass filters; circuit tuning; diaphragms; etching; harmonic distortion; isolation technology; low-pass filters; micromachining; micromechanical devices; 30 to 300 Hz; ONO membrane; audio frequency filters; band-pass filters; design parameters; dynamic range; electrothermal elements; etch window patterning; heater; loop filters; low-pass characteristics; micromachined structures; temperature sensor; thermal coupling; thermally-isolated diaphragm structures; tunable cutoff frequency; Circuit testing; Coupling circuits; Cutoff frequency; Dielectric measurements; Electric variables measurement; Electrothermal effects; Filters; Frequency measurement; Integrated circuit measurements; Temperature sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems, 2000. MEMS 2000. The Thirteenth Annual International Conference on
Conference_Location
Miyazaki
ISSN
1084-6999
Print_ISBN
0-7803-5273-4
Type
conf
DOI
10.1109/MEMSYS.2000.838505
Filename
838505
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