Title :
Failure mechanisms of pressurized microchannels, model and experiments
Author :
Blom, M.T. ; Tas, N.R. ; Pandraud, G. ; Chmela, E. ; Gardeniers, J.G.E. ; Tijssen, R. ; Elwenspoek, M. ; van den Berg, A.
Author_Institution :
MESA Res. Inst., Twente Univ., Enschede, Netherlands
Abstract :
Microchannels were created by fusion bonding of a Pyrex and a thermally oxidized silicon wafer. The maximum pressure which can be applied to these channels was investigated. In order to find the relation between this maximum pressure, channel geometry, material elasticity and bond energy, an energy model was developed. It was shown that the model is substantiated by the pressure data, from which it could be calculated that the effective bond energy increased from 0.018 J/m2 to 0.19 J/m2 for an annealing temperature ranging from 310°C to 470°C
Keywords :
adhesion; annealing; elastic deformation; glass; high-pressure techniques; mechanical contact; microfluidics; semiconductor device models; silicon; surface energy; wafer bonding; 310 to 470 C; Pyrex wafer; Si; annealing temperature; bond energy; channel geometry; elastic adhesive contact model; elastic deformation energy; energy model; failure mechanisms; fusion bonding; high pressure microchannels; hydraulic energy; material elasticity; maximum pressure; pressurized microchannels; surface energy; thermally oxidized silicon wafer; total energy; work of adhesion; yield pressures; Annealing; Elasticity; Failure analysis; Geometry; Microchannel; Semiconductor device modeling; Silicon; Solid modeling; Temperature distribution; Wafer bonding;
Conference_Titel :
Micro Electro Mechanical Systems, 2000. MEMS 2000. The Thirteenth Annual International Conference on
Conference_Location :
Miyazaki
Print_ISBN :
0-7803-5273-4
DOI :
10.1109/MEMSYS.2000.838516
