Fine-pitch MOEMS packaging for novel Spatial Light Modulator

A novel SLM (spatial light modulator), named SOM (spatial optical modulator) has been developed. SOM is one dimensional mirror array device, so the pixel number and the dimension of the mirror array could be easily designed for application specific. Full-HD rear projection displays with 1080-pixel SOM devices and VGA resolution embedded mobile projection displays with 480-pixel SOM devices have been developed. SOM device packaging was designed, characterized and fabricated for high resolution and high quality displays. Fine-pitch interconnections as well as submount fabrication, hermetic sealing, PCB bonding, wire bonding and bond wire passivation processes were designed and accomplished. The dimension of the packaged SOM chip modules were 27.4times68.3times4.6 mm³ and 13.4times12.0times3.1 mm³ for RPTV(rear projection tele-vision) and pico-projection modules, respectively. The mechanical, electrical, thermal and optical characteristics like as bending, thermal distribution and its uniformity, electrical noise characteristics were controlled.