Thermal management and novel package design of high power light-emitting diodes

Thermal management and package materials in high power light emitting diodes (HPLEDs) are now critical design issues to limit their luminous intensity, reliability, and applications. In this paper electroless and electroplating techniques (EET) were both applied in fabrication of the red, green, and blue HPLEDs (RGB HPLEDs) chips. The HPLEDs with conventional package structures were fixed on the lead frames by adhesives, but the HPLEDs using EET were fixed on copper substrates without any adhesive resin. In our work, the results show that the thermal resistance of HPLED using EET is much less than one of the HPLED using adhesive resin. The maximum luminous intensity of the single chip HPLED using EET is larger than HPLED with resin/MCPCB (metal core printed circuit board) in room temperature.