• DocumentCode
    1946963
  • Title

    A monolithic fully-integrated vacuum-sealed CMOS pressure sensor

  • Author

    Chavan, A.V. ; Wise, K.D.

  • Author_Institution
    Center for Integrated MicroSyst., Michigan Univ., Ann Arbor, MI, USA
  • fYear
    2000
  • fDate
    23-27 Jan 2000
  • Firstpage
    341
  • Lastpage
    346
  • Abstract
    This paper presents an integrated multitransducer capacitive barometric pressure sensor that is vacuum-sealed at wafer level. The interface circuitry is integrated directly within the sealed reference cavity, making the device immune to parasitic environmental effects. The overall device process merges BiCMOS circuitry with a dissolved wafer transducer process, is compatible with bulk- and surface-micromachining, and employs chemical mechanical polishing (CMP), anodic bonding, and hermetic lead transfers. The sensor achieves 15b resolution and is suitable for low-cost packaging. The device is composed of a programmable switched capacitor readout circuit, five segmented-range pressure transducers, and a reference capacitor, all integrated on a 7.5×6.5 mm2 die using 3 μm features
  • Keywords
    CMOS integrated circuits; capacitive sensors; microsensors; pressure sensors; seals (stoppers); BiCMOS circuit; anodic bonding; bulk micromachining; capacitive barometric CMOS pressure sensor; chemical mechanical polishing; dissolved wafer process; hermetic lead transfer; integrated multitransducer; interface circuitry; monolithic integration; packaging; programmable switched capacitor readout circuit; reference capacitor; segmented range pressure transducer; surface micromachining; vacuum sealing; BiCMOS integrated circuits; Capacitive sensors; Chemical processes; Chemical sensors; Chemical transducers; Mechanical sensors; Packaging; Switched capacitor circuits; Switching circuits; Wafer bonding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2000. MEMS 2000. The Thirteenth Annual International Conference on
  • Conference_Location
    Miyazaki
  • ISSN
    1084-6999
  • Print_ISBN
    0-7803-5273-4
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2000.838540
  • Filename
    838540