DocumentCode :
1946963
Title :
A monolithic fully-integrated vacuum-sealed CMOS pressure sensor
Author :
Chavan, A.V. ; Wise, K.D.
Author_Institution :
Center for Integrated MicroSyst., Michigan Univ., Ann Arbor, MI, USA
fYear :
2000
fDate :
23-27 Jan 2000
Firstpage :
341
Lastpage :
346
Abstract :
This paper presents an integrated multitransducer capacitive barometric pressure sensor that is vacuum-sealed at wafer level. The interface circuitry is integrated directly within the sealed reference cavity, making the device immune to parasitic environmental effects. The overall device process merges BiCMOS circuitry with a dissolved wafer transducer process, is compatible with bulk- and surface-micromachining, and employs chemical mechanical polishing (CMP), anodic bonding, and hermetic lead transfers. The sensor achieves 15b resolution and is suitable for low-cost packaging. The device is composed of a programmable switched capacitor readout circuit, five segmented-range pressure transducers, and a reference capacitor, all integrated on a 7.5×6.5 mm2 die using 3 μm features
Keywords :
CMOS integrated circuits; capacitive sensors; microsensors; pressure sensors; seals (stoppers); BiCMOS circuit; anodic bonding; bulk micromachining; capacitive barometric CMOS pressure sensor; chemical mechanical polishing; dissolved wafer process; hermetic lead transfer; integrated multitransducer; interface circuitry; monolithic integration; packaging; programmable switched capacitor readout circuit; reference capacitor; segmented range pressure transducer; surface micromachining; vacuum sealing; BiCMOS integrated circuits; Capacitive sensors; Chemical processes; Chemical sensors; Chemical transducers; Mechanical sensors; Packaging; Switched capacitor circuits; Switching circuits; Wafer bonding;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems, 2000. MEMS 2000. The Thirteenth Annual International Conference on
Conference_Location :
Miyazaki
ISSN :
1084-6999
Print_ISBN :
0-7803-5273-4
Type :
conf
DOI :
10.1109/MEMSYS.2000.838540
Filename :
838540
Link To Document :
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